SPD350 nti sib tsoo tshuab yog lub siab -kawg cov cuab yeej tshwj xeeb tsim tshwj xeeb uas tsim los rau qhov tseeb thinning thiab planar sib tsoo ntawm semiconductor chips thiab wafers. Nws tseem yog ib qho tseem ceeb ntawm cov cuab yeej precision tseem ceeb hauv cov kev sib txuas tseem ceeb ntawm cov ntim ntim thiab cov txheej txheem wafer, sib txuas cov kws tshaj lij thiab ntau yam. Cov cuab yeej tsom mus rau qhov siab precision, siab ruaj khov thiab ntse automated ua haujlwm. Nws tuaj yeem hloov kho kom haum rau kev ua haujlwm ntawm 2-8 nti puv -kev qhia tshwj xeeb wafers. Lub peev xwm ua tiav ntawm ib lub tshuab ntau tshaj 80 kilograms ib teev, nrog rau qhov muaj peev xwm ua tau zoo. Cov txheej txheem tseem ceeb yog tswj tau nruj me ntsis. Kev sib tsoo thickness raug ncav cuag ± 2μm. Cov zis loj txhawb nqa cov lus qhia tshwj xeeb ntawm 1 × 1mm² thiab 2 × 2mm² nrog rau kev hloov kho tus kheej. Qhov saum npoo roughness Ra yog tsawg dua 100nm, thiab qhov sib tsoo tsis sib xws yog tsawg dua 5%. Nws ua tau raws li cov txheej txheem nruj heev rau chip thinning tsim, txuag hluav taws xob zoo, thiab kev ntseeg siab ntev ntev.
Lub tshuab tag nrho yog nruab nrog cov kev tswj xyuas cov lej ntse, nrog rau kev sib tsoo tus nqi raug kho tau, ua kom muaj txiaj ntsig ntau lawm thiab txo qhov kev pheej hmoo ntawm kev tsis xws luag xws li chipping thiab micro- puas ntawm workpieces. Cov khoom siv nruj me ntsis ua raws li DIN 66399 tus qauv E7 kev nyab xeeb, nrog rau qhov tseeb thiab kev sib raug zoo mus txog qhov siab tshaj plaws. Nws yog dav siv nyob rau hauv cov tub ntxhais semiconductor teb xws li integrated circuits, hwj chim pab kiag li lawm, thiab optoelectronic chips. Nws tuaj yeem tsis tsuas yog hloov mus rau me me thiab nruab nrab- qhov loj me batch R&D thiab kev sim ntau lawm tab sis kuj ua tau raws li qhov xav tau ntawm loj- nplai ntau lawm, pab cov tuam txhab semiconductor ua tau zoo thiab siab - zoo precision sib tsoo ua. Nws yog cov khoom siv zoo tshaj plaws rau kev tsim cov txheej txheem ntawm cov semiconductors.
